Intel Expands Chengdu Packaging and Testing Facility, Injecting $300 Million in Capital
10/29/2024 18:44
On October 28, Intel, the U.S. semiconductor giant, announced a $300 million capital increase to expand its packaging and testing facility located in Chengdu’s High-Tech Zone. This expansion will add packaging and testing capabilities for server chips alongside its current client products and establish a Customer Solutions Center, enhancing local supply chain efficiency and bolstering support for its Chinese clients. Planning and construction for these upgrades are already underway.
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