Intel Expands Chengdu Packaging and Testing Facility, Injecting $300 Million in Capital
10/29/2024 18:44
On October 28, Intel, the U.S. semiconductor giant, announced a $300 million capital increase to expand its packaging and testing facility located in Chengdu’s High-Tech Zone. This expansion will add packaging and testing capabilities for server chips alongside its current client products and establish a Customer Solutions Center, enhancing local supply chain efficiency and bolstering support for its Chinese clients. Planning and construction for these upgrades are already underway.
This article is for members only. You can read the rest after application confirmation.
Register now Login
Register now Login
Related articles
- 10/30/2024 Liquid Semiconductors? Hydrogel-Based Semiconductor Material for Bio-Integrated Circuits Unveiled
- 10/28/2024 TSMC Reports U.S. Chip Factory Achieves Higher Yield Than Taiwan Counterparts
- 10/21/2024 Samsung Announces Complete Withdrawal from LED Business
- 10/16/2024 5N Plus Inc. Surpasses 2024 Production Target and Announces Further Capacity Expansion
- 10/02/2024 China’s Semiconductor Industry Self-Sufficiency Rate Continues to Rise, Expected to Reach 26.6% by 2027
- 09/26/2024 China Initiates Anti-Discrimination Investigation into Canada’s Restrictive Measures
- 09/06/2024 TSMC Expands Advanced Packaging Capacity by Fourfold, Taiwanese Companies Unite to Develop Ecosystem
- 08/30/2024 Japan’s Proud Electrolytic Copper Foil Technology: Insights from the Industry Leader Nippon Denkai
- 07/27/2023 September 1 (Friday) 1st SEMICON (Semiconductor) Summit in TOKYO
- 05/15/2023 【Schedule of lectures】8.2.BatterySummitGlobalSummer 9.1Semiconductor Summit to be held
