On October 28, Intel, the U.S. semiconductor giant, announced a $300 million capital increase to expand its packaging and testing facility located in Chengdu’s High-Tech Zone. This expansion will add packaging and testing capabilities for server chips alongside its current client products and establish a Customer Solutions Center, enhancing local supply chain efficiency and bolstering support for its Chinese clients. Planning and construction for these upgrades are already underway.
This article is for members only. You can read the full content after your subscription is confirmed.
