TSMC Expands Advanced Packaging Capacity by Fourfold, Taiwanese Companies Unite to Develop Ecosystem
09/06/2024 16:58
According to Tencent News, Taipei, September 4, 2024 – At the SEMICON Taiwan 2024 exhibition, TSMC announced a significant increase in its advanced packaging technology capacity, particularly for CoWoS (Chip-on-Wafer-on-Substrate), to meet the soaring global demand for AI chips and high-performance computing (HPC).
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